Abstract
Based on a de-embedding technique, a new method is proposed which is capable of evaluating chip impedance behavior over absorbed power in flip-chip bonded UHF radio frequency identification transponder ICs. For the de-embedding, four compact co-planar test fixtures, an equivalent circuit for the fixtures, and a parameter extraction procedure for the circuit are developed. The fixtures are designed such that the chip can absorb as much power as possible from a power source without radiating appreciable power. Experimental results show that the proposed modeling method is accurate and produces reliable chip impedance values related with absorbed power.
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