Chip Card Globe Top Module Robustness Study

Abstract

Usage of security smart card is growing rapidly in recent electronic world. Unquestionably in the next decade, each individual would need at least one smart card to store and secure his or her confidential information for daily application. Therefore the robustness of chip card module plays the most important role in the smart card application. This paper discusses about the robustness of Globe Top (GT) Module through a complete qualification flow which includes module level and card level reliability tests. The objective of this qualification is to prove the quality of current GT module manufactured in house for market application. Basically in this study, two modules type namely Memory M3.2-SLE55XX and Controller M5.1-SLE66XX had been selected. These two modules coupled with two types of glass epoxy (FR4) tape were evaluated. Internal assembly level reliability data including die shear, wire ball size, wire ball height, wire pull, ball shear, loop height, wire sweep, encapsulation dam & fill dimension and thickness were collected and analyzed. Meanwhile reliability tests for modules level and card level which include thermal, climatic, chemical and mechanical resistance were tested. Reliability results revealed that these two packages passed the entire qualification requirements and proven to be robust for smart card application.