Abstract
Volatile reaction enhanced fluoridation of metal surface is shown to produce excellent passivated metal surfaces exhibiting complete resistance to corrosive gases and reactive gas plasma bombardment. Fluoridation is carried out on Ni‐P plated films on aluminum where the films contain 3.6–12 weight percent (w/o) phosphorus. Composition of the fluoride film on a Ni‐P surface is confirmed to be where phosphorus is converted to , and is evaporated from the film during fluoridation, i.e., reaction of Ni‐P with fluorine gas. An activation energy of the fluoridation of Ni‐P film decreases with a certain amount of phosphorus concentration. Thus, this fluoridation is referred to by us as volatile reaction enhanced fluoridation. The films are demonstrated to exhibit very strong resistance to corrosive gases and reactive gas plasma bombardment.
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