Abstract
AbstractErhitzen eines heißgepreßten Si‐nitrids der Zusammensetzung (I) vor seiner Weiterverarbeitung auf 1400°C in Ar führt zum Verschwinden der interkristallinen Glasphase sowie zu einer Reduzierung des Gehalts an Si‐oxynitrid, was eine weiche, leicht abreibbare Oberfläche zur Folge hat.
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