Abstract
AbstractChemically stable polyphenylene ether (PPO) microcapsules (MCs) filled with epoxy resins (PPO‐EP MCs) were prepared using low‐molecular‐weight PPO with vinyl end‐groups as shell wall and epoxy resins as core material using an oil‐in‐water emulsion solvent evaporation method. This method for synthesizing MCs with PPO shell walls is simple, convenient and novel, which can avoid the influence of processing parameters on the chemical stability of the epoxy resin core material. The resulting PPO‐EP MCs exhibit good chemical stability below 255 °C mainly owing to the absence of a polymerization catalyst of the epoxy resins. The initial thermal decomposition temperature of the MCs is about 275 °C. The MCs were embedded in a 4,4′‐bismaleimidodiphenylmethane/O,O′‐diallylbisphenol A (BMI/BA) thermosetting resin system. When processed at high temperature (up to 220 °C), the microencapsulated epoxy resins could be released from the fractured MCs to matrix crack surfaces and bond the crack surfaces. An amount of 8 wt% MCs restored 91 and 112% of the original fracture toughness of the BMI/BA matrix when heated at 220 °C/2 h and 80 °C/1 h + 220 °C/2 h, respectively. The MCs only slightly decreased the thermal property of the matrix. © 2016 Society of Chemical Industry
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
