Abstract
This communication introduces chemically bonded (CB) composite sol–gel (SG) technology. The composite includes majority (>80 vol%) particulate filler, the balance being SG‐derived bonding phase. Ceramic bond formation in such a composite is induced through chemical reaction rather than through sintering. In the particular variant of the process presented here, the reactivity of the SG‐derived alumina ceramics toward phosphates, such as aluminum phosphate or phosphoric acid, is explored to produce a ceramic (reaction) bond in the system without sintering. This allows attaining structural integrity of the composite at relatively low temperatures of 300°C. Several examples of 40–200 μm thick films of CB alumina on stainless steel, Mg and Al, Ni, and on carbon fiber‐reinforced epoxy are discussed.
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