Abstract
For via hole‐filling in very‐ and ultra‐large‐scale integrated application, a CVD‐W process with an additional, intermediate chemical vapor deposited layer between Al and W was successfully applied. The approximately 150 nm thick layer was characterized in detail by analytical transmission electron microscopy. After various heat‐treatments, the crystalline fraction of the mainly amorphous consists predominantly of β‐W and/or hexagonal . With increasing thermal load Al diffuses into the resulting in the formation of Kirkendall pores.
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