Abstract
A new method of transient liquid phase (TLP) bonding of alumina specimens has been developed using a mixture of aluminium powder and silica powder as insert materials. A chemical reaction of aluminium with silica occurs in the inter layer to produce alumina and silicon. Some of the specimens were subjected to cold isostatic pressing (cipping) before bonding to improve the bonding strength. Specimens with an interlayer of powder mixture were joined for Al/SiO2 ratios of 1 : 0.84 and 1 : 0.42, but did not join for an interlayer with a theoretical ratio of 1 : 1.67. When specimens were subjected to cipping before bonding, bonds were far stronger than bonds without cipping in a temperature range from room temperature to elevated temperatures above the melting point of aluminium. In the mechanical test (bending test), fracture occurs at the boundary between the alumina matrix and the interlayer at room temperature, and in the interlayer at temperatures above the melting point of aluminium.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
