Abstract
SUMMARYChanges in specular reflectivity and weight loss during chemical polishing of copper in sulphuric-nitric-hydrochloric acid solutions were studied using reflective and gravimetric methods, scanning electron microscopy (SEM) and electrochemical measurements. The results show that chemical polishing is comprised of three stages, i.e. etching, polishing and pitting. The mechanism of chemical polishing is further discussed.
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