Chemical metallisation of cubic boron nitride for the production of composite materials

Abstract

Data are reported on the successful metallisation of cubic boron nitride by chemical reduction of solutions containing nickel and cobalt ions. The processes of growth of these two types of films differ substantially from each other. While in cobalt plating no screw-like dislocation mechanism film growth is observed, in nickel plating growth is by a screw-like dislocation mechanism. The titanium film deposited as a pretreatment on grains of cubic boron nitride does not influence the rate and structure of subsequent cobalt and nickel deposition. Thus, the metallised super-hard material obtained is useful for embedding into composite materials for the production of abrasive materials.