Abstract
The chemical mechanical polishing of yttrium aluminum garnet (YAG) using a commercial slurry (Ultra-Sol 500s) is investigated. Surfaces are polished to below 0.5 nm RMS surface roughness, with a controllable polishing rate of 0.3 nm / min. In addition, high resolution x-ray diffraction measurements show an improvement in crystal quality after polishing. After polishing, samples are further cleaned with citric acid and sodium hypochlorite solutions to remove any remaining slurry particles. Surfaces with < 0.5 nm RMS surface roughness are suitable for wafer bonding, and are treated with various surface preparation steps prior to bonding. Once bonded at room temperature, samples are heated at 1300{degree sign} C for 48 hours to further strengthen the bond.
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