Charging Compensation Layer on Polyimide for Enhanced Device Stability in Flexible Technology

Abstract

In this paper, we propose a structure that prevents the charging effects that occur in devices fabricated on polyimide (PI) substrates. In general, when fabricating a device on a PI substrate, an inorganic barrier layer is first deposited to prevent penetration of oxygen and moisture. In this study, we confirmed that fluorine ions were induced from PI by bias stress and proposed a SiOCH/SiO2 double layer as a barrier to prevent charging. Then, Al/PI/SiO2/Al and Al/ PI/SiOCH/SiO2/Al metal–insulator–metal capacitors were manufactured. The capacitor characteristics before and after application of bias stress were verified through current–voltage (I–V) and capacitance–voltage (C–V), which are electrical characterization methods, and secondary ion mass spectrometry (SIMS), which is a physical analysis method. As the voltage increased, the capacitance and current of the Al/PI/SiO2/Al capacitor varied, but those of the Al/PI/SiOCH/SiO2/Al device did not change. Finally, SIMS analysis confirmed that the PI-derived fluorine ions replaced the Si–CH3 bonds within the SiOCH film with Si–F bonds, thereby preventing capacitance and current fluctuations.