Charge trapping at Pt/high- k dielectric (Ta 2O 5) interface

Abstract

A detailed analysis of the effects of constant low current injection was done, both in accumulation ( J=0.001–0.2 mA cm −2) and in inversion ( J=0.001–0.04 mA/cm 2). The samples under investigation were metal–insulator–silicon structures containing high- k dielectric Ta 2O 5 radio frequency sputtered on p-type Si wafers, with Pt metal gate electrodes. The obtained results were compared with the ones obtained for Al gate samples. This experiment confirms the occurrence of charge trapping in the case of high-work-function Pt as metal. The effect has been attributed to emitting of electrons into the Pt conduction band during which creation of empty traps in the dielectric occurs, which then attract electrons injected in the dielectric. In order to examine the reversibility of the process, successive short runs as well as long runs (up to 10000 s) were performed.