Abstract
The V/sub th/ instability of nMOSFET with HfSiON gate dielectric under various stress conditions has been evaluated. It is shown that after constant voltage stress, the threshold voltage (V/sub th/) relaxes to its initial prestress value. The relaxation rate is strongly affected by the stress duration and magnitude rather than injected charge flux or magnitude of the V/sub th/ shift. It is proposed that spatial distribution of trapped charges, which is strongly affected by the stress conditions, determines the relaxation rate. The implications of the electron trapping/detrapping processes on electrical evaluation of the high-/spl kappa/ gate dielectrics are discussed.
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