Abstract

Abstract Epoxy resins cured with polyfunctional active esters have no pendant hydroxyl groups but pendant ester groups. Epoxy resins without hydroxyl groups are expected to have high electric resistance, low dielectric constant, and low hygroscopicity. In this paper, the thermal, viscoelastic, dielectric, and hygroscopic properties are described on the epoxy resins cured with active esters in comparison with those of the resins with pendant hydroxyl groups that are cured with conventional curing agents. The network structure of epoxy resins with pendant ester groups is much looser than that of the resins with pendant hydroxyl groups. This is attributed to the lack of hydrogen bonds and to steric hindrance and plasticization of more bulky ester groups in the resins cured with active esters.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.