Abstract

A Ge ion implantation using a multiple-step energy into ZnO bulk single crystals is performed (net concentration: 2.6×1020cm−3). The origins of low resistivity of the Ge implanted ZnO samples are studied by Rutherford backscattering spectroscopy (RBS), photoluminescence (PL). The resistivity measured by Van der Pauw method decreases from ∼103Ωcm for the un-implanted samples to 1.45×10−2Ωcm for the as-implanted samples, originating from the lattice displacement of Zn (Zni) (∼30meV [Look et al., Phys. Rev. Lett. 82, 2552 (1999)]), the existence of which is revealed by the RBS measurements. In contrast, the 1000°C annealed samples show the higher resistivity of 6.26×10−1Ωcm, indicating that the Zni related defects decrease but still remain despite the annealing. A new PL emission appears at around 372nm (3.33eV) in the annealed samples, suggesting a Ge donor with an activation energy of 100meV. This value corresponds to the activation energy (102meV) of a Ge donor estimated from the temperature dependence of carrier concentration. These results suggest that the resistivity in the 1000°C annealed samples results from both the Zni related defects and the electrically activated Ge donor.

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