Abstract
In the present work, we report the interfacial reaction characteristics between sputter-deposited Ni film and a single crystalline Si substrate. The effect of substrate bias during the deposition process on the interfacial reaction is also discussed. It was found that sputter deposition with a substrate bias can promote the interfacial reaction between Ni film and Si substrate. Under our experimental conditions, Ni2Si (orthorhombic) with good crystallinity formed in the film when it was deposited at 200 °C and with a -80 V substrate bias. Such films had relatively low resistivity. Upon thermal annealing at 500 °C, NiSi formed through further reaction, however there is almost no change in resistivity.
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