Abstract
Printed circuit boards (PCBs) are frequently exposed to a complex combination of external and internal thermo-mechanical loads (static, cyclic and impact loads superimposed by local and global temperature effects). In this study, instrumented impact tests of the PCBs were performed and characterized. In addition to the acceleration measurement of the impact, the deformation behaviour was analyzed using a high speed camera and strain gauges. To reduce the testing effort for future PCB design the oscillation behavior of the PCB after impact was simulated using a finite element (FE)-software. Dynamic mechanical analysis experiments were performed and a linear viscoelastic material model was defined. Furthermore, the results of the simulation were compared to the measured values. In spite of the difference in the measured and simulated frequency values over the time, the viscoelastic effects including the damping behaviour were reflected accurately in the simulation.
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