Abstract
NiTi shape memory alloy thin film sputter-deposited on a large scale silicon wafer was characterized by means of instrumented (depth-sensing) indentation technique. Thickness of deposited thin film was measured by calotest device. Microstructure of thin film was observed using differential interference (Nomarski) contrast. It was shown that the local mechanical properties are different in areas containing different phases (austenite and martensite) according to different deposition conditions (kinetic energy of deposited atoms when impacting the substrate surface).
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