Abstract
Various concentrations of copper are embedded into silica matrix to xerogels form using copper source—Cu(NO3)2·3H2O. The xerogel samples are prepared by hydrolysis and condensation of tetraethyl orthosilicate (TEOS) with determination of new molar ratio of components by the sol–gel method. CuO/SiO2 nanocomposite is prepared with mixture of components with new molar ratio of H2O/TEOS to be 6.2. In this investigation, the necessary amount of trihydrated copper nitrate is added to the solution in such a manner that the concentration of the copper oxide in final solution reaches 1, 2 and 5 wt% (samples A, B and C, respectively). After ambient drying, the gel samples are heated from 60 to 1,000 °C at a slow heating rate (50 °C/h). Thermal treatment effect is characterized by Fourier transmission infrared, thermal gravimetric analysis, X-ray diffraction, transmission electron microscopy, scanning electron microscopy, surface analysis and thermal program reduction methods at different temperatures.
Highlights
Organic and inorganic materials molecular chemistry has made a great progress during the last few decades
Three samples of CuO/SiO2 nanocomposite in xerogel form were prepared by the sol–gel method and another one was prepared as a blank sample using tetraethyl orthosilicate (TEOS) hydrolyzed with HNO3 and CH3COOH, ethanol and deionized water (DI) with new total molar ratio of TEOS:ETOH:H2O = 1:1.3:6.2 [8]
TPR analysis of the samples treated at different temperatures is presented in the Fig. 7
Summary
Organic and inorganic materials molecular chemistry has made a great progress during the last few decades. Sol–gel method is a relatively new technique for preparation of glasses to get high purity and homogeneity at low temperatures processing [4]. Mohanan and Brock [8] have studied copper oxide silica aerogel composites by varying pH values, copper precursor salts, and treatment temperatures. They found that base-catalyzed gels underwent a gradual change from bonded Cu?2 to segregated CuO at different heating conditions. Parler et al [9] observed silicon–oxygen–metal bond formation during both synthesis and drying stages at low temperatures with relative high copper concentration Some properties such as bacterial inhibitory capacity depend highly on the copper ion
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