Abstract
Passive CMOS pixel sensors in 150nm CMOS technology offered by LFoundry were designed and assembled into hybrid pixel modules. Advantages of commercial CMOS processes are high throughput at comparatively low costs which makes them attractive for the usage of large-area detectors. Further benefits originate from multiple metal layers, metal–insulator–metal capacitors, and polysilicon layers which can be used to enhance the sensor design. Thinned sensors were bump-bonded to the RD53A readout chip and characterized in laboratory environment and with a minimum ionizing 2.5GeV electron beam. Their performance in terms of noise and hit-detection efficiency equals that of conventional planar pixel sensors.
Published Version
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