Abstract
In this work, a novel sequential dual-curing system based on thiol-acrylate-epoxy formulations is developed and characterized. Both reaction stages are thermally activated and sequentially relies on difference in the kinetics of the reactions involved. The viability of this system is successfully tested for low curing temperatures and the kinetic of the entire process is completely characterized. Differential scanning calorimetry and Fourier transform infrared spectroscopy analysis revealed an adequate separation between the reactions that leads to a wide interval of time during which the intermediate material can be considered stable. Applicability tests on the resulting thermosets showed the high capability of the intermediate materials to be conformed in complex shapes that can be fixed by means of the second curing stage. This system also shows great potential to be used as adhesive bonding taking advantage of the two-step curing process.
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