Characterization of platinum films deposited by focused ion beam-assisted chemical vapor deposition

Abstract

This work presents results from the characterization of ion-assisted chemical vapor deposition of platinum from trimethyl–methylcyclopentadienyl–platinum (C9H16Pt). Films were deposited in squares ranging from 50 to 200 μm on a side using a focused ion beam system. The effects of Ga+ ion flux and precursor flux on the deposited films’ composition and resistivity were determined. Films were characterized using atomic force microscopy, Rutherford backscattering spectrometry, and Auger electron spectroscopy. Results show that increasing precursor flux at constant ion flux increases Pt and C, but decreases Ga content of the film. Increasing ion flux at constant precursor flux increases Pt content, while decreasing C content of the films. Resistivity did not depend on the thickness of 50–200 nm thick films. Resistivity was shown to follow C content, with films with lower C content having lower resistivity.