Characterization of PCB routing process and optimization of tool design based on the investigation of routing temperature

Abstract

Purpose – The purpose of this paper is to provide the method and system to conduct online measurement and the characterization of temperature during printed circuit board (PCB) routing process as well as the optimization of router design based on the investigation of routing temperature. Design/methodology/approach – The background of this research is introduced first. Then the method to measure the routing temperature on-line by using an infrared camera is presented. The routing process is characterized by investigating the routing temperature. Tool design optimization is conducted based on the temperature in processing PCB with aluminum substrate. Finally the concluding remarks of this research are presented. Findings – The routing temperature can be accurately measured by an infrared camera. Routing temperature is sensitive to properties of PCB, types of router and routing parameters. Very high temperature is experienced if non-appropriate routers are used to process board with aluminum substrate. It is demonstrated by the experiments that two fluted tool, three fluted tool and coated tool with three flutes are suitable for aluminum substrate processing by considering the low temperature and the nice surface finish. Originality/value – The paper highlights the key points to measure the routing temperature on-line by an infrared camera and characterize the routing process and optimize the tool design by investigating the measured temperature as well.