Abstract
For the application of wireless-operated microsystems, on- chip coils are manufactured by 3D UV depth lithography and electroplating. The effects of varying the following parameters were investigated: substrate material, insulation thickness, coil material, coil structure height, coil design and the effect of using an intermediate NiFe layer. The characterization is done with the help of the measured real and imaginary part of the on-chip in a continuous frequency range of 75 kHz to 30 MHz.
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