Abstract
A novel die-attaching technology, using the in-situ dewetting of Ag shells in submicrometer Ag-coated Cu (Cu@Ag) particles during heating in air, was suggested for power device packaging. The particle size-dependent dewetting of Ag induced the formation of tiny nodules and rapid sinter bonding via fast Ag transfer under external pressure. A die attached by thermal compression for 5min at 225°C using 200- or 350-nm Cu@Ag particles showed shear strengths approaching or surpassing that (18.0MPa) of a die attached using Pb-5Sb.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
