Characterization of Microcrystalline Si Films by MeV Ion Scattering Techniques

Abstract

AbstractRutherford Backscattering Spectroscopy (RBS) and channeling studies with 1.4 MeV−4He ions as well as Heavy-Ion Elastic Recoil Detection Analysis (HI-ERDA) with 230 MeV 129Xe ions have been applied to characterize structural properties and the impurity content of thin Si films. The analytical potential of these ion-beam techniques is demonstrated for two types of samples: (1) μc-Si films prepared by dc magnetron sputtering in a pure Ar plasma and (2) homoepitaxial Si films deposited by low-temperature electron-cyclotron resonance PECVD at the transition from oriented to disordered growth. For μc-Si the atomic area density N.d obtained by RBS was compared with the optical thickness n.d (n=refractive index) derived from the interference structure of IR reflection spectra. It is shown that the ratio R=n.d/N.d of these quantities can serve as a figure of merit for the degree of crystalline order. An apparent similarity was found in the case of the epitaxially grown films between the Si disorder profiles evaluated from the RBS channeling spectra and the hydrogen and oxygen profiles determined by HI-ERDA. This suggests that hydrogen and oxygen are preferentially incorporated in the disordered parts of the films.