Abstract

Reliability and durability tests play a key role in the photovoltaic (PV) industry by minimizing potential failure risks for both existing and new cell and module technologies. In this work, a detailed study of contact degradation in monocrystalline and multicrystalline PV modules is performed. The modules are subjected to a sequence of damp heat (DH) exposures followed by electrical characterization after each step. Electroluminescence (EL) imaging shows different darkening patterns for monocrystalline modules compared to multicrystalline modules; the former shows darkening near the busbars and the latter shows it across virtually the entire cell surface. The primary loss mechanism is confirmed to be resistive after comparing the current-voltage ( I–V ) characteristics at each DH exposure step. Representative samples have been cored out from both the degraded modules and controls for materials characterization to gain further insights into the degradation mechanism. Top-down and cross-sectional scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and top-down high-resolution X-ray photoelectron spectroscopy (XPS) analysis performed on the cored samples confirm the degradation is due to metallization corrosion. Our study suggests that the difference in the darkening pattern can most likely be attributed to the different silver paste composition used for contacting each cell technology, particularly the composition of the glass frit. • Monocrystalline and multicrystalline PV modules show different cell darkening patterns in EL images after damp-heat exposure. • Performance losses are due to an increase in series resistance, not to any increase in the optical or recombination losses. • Primary reason for performance losses is the degradation of metal contacts, particularly the glass layer/metal-Si interface. • Sn migration from the interconnects to the metal contact surface plays a key role in accelerating the glass layer corrosion. • Difference in the darkening pattern can be attributed to the Ag paste composition used for contacting each cell technology.

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