Abstract
The properties of electroplated Cu films prepared using copper-hexafluoro-silicate , copper sulfate , and their mixtures in different mixing ratios as electrolytes were investigated. We compared the stress, resistivity, self-annealing effect, microstructure, growth rate, impurity, and reliability of the as-deposited electroplated Cu films. We found that electroplated Cu films using a higher fraction of in the electrolyte exhibited lower resistivity, a denser structure, lower stress, and a less-apparent self-annealing effect. A reliability comparison between the and the electroplated Cu films was also conducted. A fixed current was applied through a simple metal line structure at an elevated temperature of . The electroplated films had a longer time-to-failure than the electroplated Cu films.
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