Abstract

ABSTRACTWe characterized a-Si:H films deposited by the electron cyclotron resonance (ECR) microwave plasma-enhanced CVD technique with the purpose of comparing ECR film quality widi that of films deposited by the rf plasma-enhanced CVD method. These ECR films were deposited in the 1–10 mT pressure region under a variety of growth conditions. Our investigations reveal the following typical properties for intrinsic ECR-deposited a-Si:H: (1) high photosensitivity as indicated by a light-to-dark DC conductivity ratio of up to 2×106, (2) a Tauc gap in the range of 1.75–1.85 eV, (3) an Urbach slope of 45–60 meV as determined by CPM and (4) an integrated deep defect density of 0.5–2×1016 cm-3 with Ec - Ef = 0.74–0.87 eV as determined by drive level profiling and junction capacitance vs. temperature scans. Variations of these quantities with deposition temperature, hydrogen dilution and magnetic field profile are discussed. Our results indicate that ECR-deposited a-Si:H is of comparable quality to a-Si:H deposited by the rf plasma glow discharge technique. ECR deposition conditions for a highly conductive type of a-Si:H film also are discussed. This material, while only slightly photosensitive and possessing an Urbach slope of over 100 meV, has a light DC conductivity of 3×10-4 (Ωcm)-1. Boron doping of this material produces a conductivity of 5×10-2 (Ωcm)-1.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.