Abstract
A nondestructive technique, based on energy-dispersive x-ray spectroscopy, was applied to characterize mass divergences in multilayer interconnects. The technique was used to reveal less than 0.5-μm-diam subsurface voids, precipitates, local changes in thickness of subsurface conducting layer, electromigration-induced mass divergences at conjugate mass source and sink in both the Al-Cu conducting layer and intermetallic compound overlayer, and a thin, hairline crack in the surface layer that is hardly visible in scanning electron microscopy.
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