Abstract
Electroless nickel and copper platings on alumina and gold substrates have been studied by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). The composition of the films was analysed using argon ion profiling. The electroless films were found to be mostly metallic and contained almost no phosphorus. In a few cases, some oxygen-containing species were identified. There was an initial unevenness in film formation which was also confirmed by SEM studies. Electroless copper films also showed the presence of oxygen-containing species. A detailed XPS study of the two metals is presented.
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