Characterization of Elastic-plastic Material Properties for IMC Layer of ENEPIG by Using Reverse Algorithm

Abstract

Recently, the reliability assurance of lead‐free solder to prevent environmental contamination is quite important issue for chip‐scale packaging. Although lots of efforts have been devoted to the solder undergone drop, shear and creep loads, there was a little research on IMC due primarily to its thickness restriction and geometric irregularity. However, the IMC is known as the weakest layer governing failures of the solder joint. The present work is to characterize realistic material properties of the IMC for ENEPIG process. Lee’s modified reverse algorithm was adopted to determine elastic‐plastic stress‐strain curve and so forth, after examining several methods, which requires inherently elastic data. In this context, a series of nano‐indentation tests as well as corresponding simulations were carried out by changing indentation depths from 200 to 400 nm and strain rates from 0.05 to 0.10 1/s. It would be conclude that effect of strain rate is relatively small and IMC layer should be more than 5 times of indentation depth when using the recommended method, which are applicable to generate realistic material properties for further diverse structural integrity simulations.