Abstract
Creep deformation on solder plays important role in life time of an electronic package. Traditionally, mechanical properties of solders have been tested using bulk solder samples. However, mechanical behaviors of bulk solder and actual solder ball exhibit huge discrepancy due to the different size of the micro structure and existence of inter metallic layers. In this reason, to acquire reliable creep behavior of the solder joint, the actual solder ball need to be tested. In this study, 2D digital image correlation (DIC) technique with microcopy is used to investigate the creep behavior of the actual BGA solder balls from the packages. The full field displacement data of the cross sectioned solder ball are generated while various constant loading is applied at different isothermal temperature. From the full field displacement data, constant creep rates of the actual BGA solder ball are obtained. Using the constants from the experiment, finite element analysis is performed to validate the experiment results by comparing the displacement of the DIC experiment results and FEA modeling.
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