Abstract
Different copper nanostructures have been deposited onto porous silicon (PS) by using HF-based solutions of CuSO4 and immersion technique. The variation of the porous template parameters and deposition regimes has been found to allow obtaining of copper nanoparticles, copper rough films and porous copper layers. The dimensions, roughness, structural parameters and phase composition of the obtained copper nanostructures have been established.
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