Abstract
In this paper, a series of Al/Ti multilayers with different modulation periods were used in copper and Al2O3 ceramic diffusion bonding. The reactive multilayer was deposited by DC magnetron sputtering, and the diffusion bonding experiments were performed at 900℃ for 10 min with a pressure of 5 MPa. The interfacial joints were inspected by scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS), X-ray diffraction and tensile shear tests. As a result, no significant metallurgical defect was observed in the microstructures of the joints. The formation of several intermetallic compounds at the interface, such as Cu/Ti eutectic and Al2O3-X·TiO compound, has further confirmed the success of Cu-Al2O3 bonding as compared to the Al/Ni nano-multilayers, which use Al/Ti nano-foils as interlayer for diffusion bonding to bring more benefit to the quality of cermet joint.
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