Characterization of 300-GHz Wireless Channel on a Computer Motherboard

Abstract

This paper presents characterization of 300-GHz wireless channel on a computer motherboard, where several different measurement scenarios have been considered. Results indicate that the presence of the ground plane and/or vertical parallel-plate structures in the channel introduces multipath that, if constructively superimposed, may create a path loss lower than free-space propagation path loss. In addition, it has been found that a few centimeters of vertical misalignment between the transmitter and the receiver result in a path loss greater than 5 dB. Furthermore, the results indicate that vertical components such as dual in-line memory modules with reflection coefficient close to one for all incident angles can be used to create directed non-line-of-sight (LoS) links with wide coherence bandwidth. Finally, for LoS propagation obstructed by large objects, such as a heatsink, the path-loss exponent of 1.77 is found, while the rotating fan causes periodic fading in the received power, indicating that channel equalization techniques will be needed to overcome deep fades. All these results indicate that optimal communications can be achieved by carefully positioning the antennas with respect to the motherboard layout.