Abstract
An important challenge to food industries is the stability of oxidation-sensitive compounds in packaged foods. In this study, we developed an eco-friendly chickpea flour film (CFF) as an innovative active food packaging material. We investigated the functional properties of films, its copper removal activity and UV-barrier properties during 90 days of storage. The water vapor permeability (1.35 × 10−11 gm−1s−1Pa−1), water content (17.50%) and solubility (35.15%), optical and mechanical properties of chickpea flour films were comparable to that of other bio-based films. The properties of CFF did not change during storage. CFF had UV-light shielding behavior and copper-removal capacity. CFF blocked more than the 95% of the UV spectrum. Maximum Cu-removal capacity (∼ 99.5%) was no affected by the concentrations of copper ions studied. The adsorption data fitted the Langmuir adsorption model, suggesting monolayer coverage. These found properties and eco-friendliness endow the chickpea flour films with great application potential as active packaging film to protect foods against UV radiation and copper promoted oxidative degradation.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
