Characterization and Reliability Verification of Wafer-Level Hermetic Package with Nano-Liter Cavity for RF-MEMS Applications

Abstract

Wafer-level packaging (WLP) is a very promising candidate for RF-MEMS packaging, especially in the mobile applications, due to the lower cost and higher volume throughput relative to the component level packaging. However, the long-term reliability of WLP is still one of the critical concerns for the commercialization of RF-MEMS devices. In this paper, a wafer-level hermetic packaging scheme based on through-wafer interconnects and wafer-to-wafer bonding will be reviewed in terms of their construction, fabrication process, and electrical/mechanical performance. The film bulk acoustic resonators (FBARs) sealed with the wafer-level packaging scheme were also undergone through harsh environment tests, such as the pressure cooker test for 300 hours, the high humidity storage test at 85degC/85%RH for 1000 hours, the high temp storage test at 125degC for 1000 hours and the temperature cycling test (-55~125degC) for 1000 cycles, to investigate the long-term reliability of the packages. The performance evaluation and reliability results of the package will also be presented.