Abstract
Individual trapped charge creations and a trap number in p-type metal-oxide-semiconductor field effect transistors (pMOSFETs) under negative bias temperature instability (NBTI) stress are investigated. We find that the characteristic times of a trapped charge creation scatter over several decades of time in small area pMOSFETs, which is attributed to an activation energy distribution in the reaction-diffusion (RD) model of NBTI. We develop a statistical model by combining the RD model with an extracted activation energy distribution to calculate a threshold voltage shift distribution at different NBTI stress times. Our model agrees with measured results very well.
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