Abstract
We have developed the ultra-thin MEMS mirror device. The thickness of the mirror device is 5.31 μm including Si structures and actuators. The mirror device was fabricated using SOI wafer on which Pt/SRO/PZT/SRO/Pt/Ti/SiO 2 were deposited. The device was bonded on a flexible polyimide substrate and wired using adhesion passed and conductive paste. The mirror device was operated on the bent substrate.
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