Characteristics of Two-Stage Γ-Gate on AlGaAs/InGaAs/AlGaAs DH-HEMTs by Using AlGaAs/InGaP Etching-Stop Layers

Abstract

Al0.22Ga0.78As/In0.18Ga0.82As/Al0.22Ga0.78As double heterojunction high electron mobility transistors (DH-HEMTs) with gate structures of traditional planar gate (PG), one-stage gamma-gate (1SΓG) and two-stage gamma-gate (2SΓG) formed by using the Al0.22Ga0.78As/In0.49Ga0.51P etch-stop layers (ESL) are simulated and presented in this work. Based on this proposed ESL structure design, the fabrication and implementation of studied DH-HEMT device with 1SΓG and 2SΓG could be expected. Both ΓG-structure devices show the better electric field property compared to PG-device. Simulated results reveal that there are no significant differences in common-source voltage-current characteristics among all studied devices. The obtained drain current density and transconductance of all studied devices are about 220 mAmm-1and 265 mSmm-1. However, the current stability of ΓG-devices with larger bias operation would be improved due to its edge-effect of ΓG extended-region. In addition, the electric field intensity under the gate-footprint is effectively reduced by both studied ΓG structures. The electric field peak value of PG-device is 498 kV cm-1, and it would be reduced down to about 210 kVcm-1and 178 kVcm-1for 1SΓG- and 2SΓG-device, respectively. On the other hand, some frequency property dropping is observed from studied device with 1SΓG or 2SΓG due to the side-edge extension of ΓG-device would create the additional parasitic capacitance. The obtained cut-off frequencies are 15 GHz, 10.5 GHz and 10 GHz for PG-, 1SΓG- and 2SΓG-device (at VGS=+5 V and VGS=-0.75 V), respectively.