Abstract
A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermomechanical and dynamic mechanical characterizations indicated that both DDSQ and POSS could effectively lower the coefficient of thermal expansion by up to approximately 34% and considerably increase the storage modulus (up to 183%). Therefore, DDSQ and POSS are promising materials for low-stress encapsulation for electronic packaging applications.
Highlights
Compared with pristine polymer nanocomposites, hybrid organic–inorganic nanocomposites comprising of functional polymers as the matrix and nanoscale inorganic constituents have attracted greater interest in both academia and industry because of their tunable and generally more favorable thermal, mechanical, electrical, and barrier properties [1,2,3]
In we focused on on the the improvement improvement of of the the dimensional dimensional stability stability of of more more flexible flexible polysiloxane-imide-containing polysiloxane-imide-containing benzoxazine (PSiBZ)
The present results indicate that as the temperature decreased below Tg, the molecules restricted the chain mobility of PSiBZ
Summary
Compared with pristine polymer nanocomposites, hybrid organic–inorganic nanocomposites comprising of functional polymers as the matrix and nanoscale inorganic constituents have attracted greater interest in both academia and industry because of their tunable and generally more favorable thermal, mechanical, electrical, and barrier properties [1,2,3]. Upgrading current thermosetting polymers has become critical because of their utilization in various applications Such as fuel cells [4], catalysis [5], membranes [6], CO2 adsorption [7], metal uptake [8], coatings [9], thermal insulation [10], and super capacitor [11]. Polybenzoxazine (PBZ) is considered a high-performance thermosetting resin because of its excellent thermal stability, high modulus, low water absorption, low surface free energy, and near-zero shrinkage upon curing [15,16,17]. Those properties are superior to some other thermosetting polymers
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