Abstract
The challenge on the thermal management of highly integrated electronic devices and avionics equipment has grown continuously. To meet fully passive and highly reliable requirements, a novel thermal storage heat pipe (TSHP) charged with phase change material (PCM) is designed. Paraffin RT70HC and graphene nanoplatelet (GNP) are used as energy storage material and heat transfer enhancer, respectively. The microstructure, chemical and thermophysical properties of RT70HC/GNP composite are systematically characterized through Scanning Electron Microscope (SEM), Fourier Transform Infrared Spectroscopy (FT-IR), X-Ray Diffraction (XRD), Differential Scanning Calorimeter (DSC) and thermal conductivity analyzer. A visualization experimental investigation is conducted to study the effects of nano-enhanced phase change material (NEPCM) on the thermal performance of TSHP at different heat fluxes. Results show that the thermal conductivity of PCM is improved maximally 21.6% by adding GNP, whereas the latent heat of fusion decreased 10.5%. It is also observed that the TSHP with NEPCM has better thermal management performances, which effectively lowers the temperature rising speed of the chipset, and extends the sustainable time to reach the chip permitted highest temperature of 85 °C. Finally, the saturation pressure of NEPCM during the melting process is measured and discussed.
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