Characteristics of Polycrystalline β-SiC Films Deposited by LPCVD with Different Doping Concentration

Abstract

The physical and electrical properties of polycrystalline -SiC were studied according to different nitrogen doping concentration. Nitrogen-doped SiC films were deposited by LPCVD(1ow pressure chemical vapor deposition) at and 2 torr using (35 sccm) and in (180 sccm) as the Si and C precursors, and in (20-100 sccm) as the dopant source gas. The resistivity of SiC films decreased from with of 20 sccm to with 100 sccm. The surface roughness and crystalline structure of -SiC did not depend upon the dopant concentration. The average surface roughness for each sample 19-21 nm and the average surface grain size is 165 nm. The peaks of SiC(111), SiC(220), SiC(311) and SiC(222) appeared in polycrystalline -SiC films deposited on substrate in XRD(X-ray diffraction) analysis. Resistance of nitrogen-doped SiC films decreased with increasing temperature. The variation of resistance ratio is much bigger in low doping, but the linearity of temperature dependent resistance variation is better in high doping. In case of SiC films deposited with 20 sccm and 100 sccm of , the average of TCR(temperature coefficient of resistance) is -3456.1 ppm/ and -1171.5 ppm/, respectively.