Abstract
Using an atomic force microscope (AFM) system and micromachined cantilever probes, we have investigated the relationship between contact forces and the fritting which should be utilized for making contact to IC pads in MEMS probe cards. As a result, it has been clarified that a stable low-resistance contact to Al and Cu films can be obtained without applying contact forces larger than 10 µN, when the applied voltage is larger than 15 V. Also, we have found that then the adhesion forces between the probe and films are less than 30 µN. In addition, the applicability of an electroplated-Ni cantilever probe card to the test of 20-µm-pitch pad IC is discussed.
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