Abstract
A new class of isotropic conductive adhesive (ICA) using a carbon nanotubes (CNTs) and a low-melting-point alloy (LMPA) fillers has been developed. We investigated the fundamental materials characteristics including curing behavior and temperature-dependant viscous property of ICA. In addition, the morphology of conduction paths in each ICA was investigated using X-ray inspection systems and an optical microscope. Mechanical and electrical characteristics of formulated ICAs were determined and compared with those of three kinds of conventional ICAs filled with Ag flakes. The CNT-filled solderable ICA formed good metallurgical interconnection between upper and corresponding lower electrode. In addition, the results indicated that the CNT-filled ICA exhibit lower electrical resistance and higher mechanical strength, as compared with those of conventional ICAs.
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