Abstract
In this paper, a comprehensive study of the machining characteristics of nanoscale ductile mode cutting of brittle materials is presented, covering the critical cutting conditions for the ductile mode of chip formation, cutting conditions for crack initiation in the chip formation zone, effect of the cutting edge radius, machined workpiece surface and subsurface damage, effect of ultrasonic vibration assistance, mechanism of nanoscale ductile mode chip formation, cutting forces, tool wear and dynamic hard particles in the chip formation zone. Systematic experiments for nanoscale cutting of a number of brittle materials, including tungsten carbide, silicon and glass, are conducted and Molecular Dynamics (MD) modelling and simulation for nanoscale cutting of monocrystalline silicon are carried out. The results are shown in detail in the paper.
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