Abstract
The diameter of the debris deposited by KrF excimer laser ablation of polyimide has been measured as a function of gaspressure and laser fluence in different ambient gas species including He, N2, air, 02, and Kr. It was shown that the amount of the debris is decreased in ambient gases with low masses or at low pressures where generation of the blast wave can be suppressed. The relationship between the measured debris diameter and the shape of the luminous plume produced by ablation of polyimide was also investigated. A XeCl excimer laser was successfully implemented in thin film line deletions of a multichip carrier used in highperformance mainframe processors. The amount of the debris on a wire bond pad nearby laser deletion was quantified as an ultrasonic power for wire bonding. The helium gas purge condition was thus optimized to reduce the debris.
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