Characteristics and properties of Bi‐11Ag solder

Abstract

PurposeThe purpose of this paper is to study Bi‐11Ag solder for higher application temperatures. The aim of the research work was to determine the soldering, thermal and mechanical properties of Bi‐11Ag solder.Design/methodology/approachTo determine the melting point interval of experimental Bi‐11Ag solder, DSC analysis was performed. The contact angles were studied on a copper, nickel and silver substrate by use of a sessile drop method. Wettability tests were realised at a temperature of 380°C in a shielding atmosphere (90% N2+10% H2). Based on experience achieved with wetting angle measurements, the specimens for measurement of shear strength of Cu, Ni and Ag/Bi‐11Ag joints were fabricated. EDX analysis was used for the study of the solder interaction with the surface of the three metallic substrates.FindingsThe best wettability at soldering in a shielding atmosphere was achieved with silver. The wetting angle at 30 min attained the value of 23°. The worst wettability was observed on copper, where at 30 min the wetting angle was 55°. Average shear strength varied from 31 to 45 MPa. The highest strength was obtained with the Cu substrate whereas the lowest was with the Ni substrate. The lowest strength achieved with the Ni substrate was caused by formation of brittle intermetallic phase NiBi3. Joint formation is realised by eutectic reaction at the contact of Bi with the surface of the copper substrate. Similar joint formation by eutectic reaction occurs also at Bi interaction with the surface of the Ag substrate. At Bi interaction with the nickel substrate a new intermetallic phase (NiBi3) is formed.Originality/valueWettability of Bi‐11Ag solder on Cu, Ag and Ni substrates was determined at application of a shielding atmosphere (90% N2+10% H2). Wettability was determined also at application of ZnCl2‐NH4Cl flux. The shear strength of Bi‐11Ag on different substrates was determined. The mechanism of joint formation was analysed.